the trend of wafer thinning is rising, and the development of the temporary bonding adhesive (tba) industry is ushering in a period of opportunity.
temporary bonding adhesive, referred to as tba, refers to an intermediate layer material used to bond functional wafers and temporary carrier boards. it generally has low cost, high adhesion, good thermal stability, strong corrosion resistance, and resistance to mechanical stress. excellent features. after development in recent years, a variety of temporary bonding adhesive products have…
