Granular epoxy molding compound (GMC) is in strong demand in the field of semiconductor packaging. Huahai Chengke is a leading company in my country

epoxy molding compound is a thermosetting chemical material processed with epoxy resin as the matrix and phenolic resin as the curing agent. according to different forms, epoxy molding compound can be divided into liquid epoxy molding compound (lmc). and granular epoxy molding compound (gmc). granular epoxy molding compound has the advantages of low thermal expansion…