and there are a large number of companies with global presence.

underfill glue (underfill glue), also known as underfill agent and underfill, refers to a thermosetting one-component, modified epoxy resin glue. underfill glue is mainly used in the circuit board assembly of high-end electronic products such as mobile phones, computer motherboards, mp4, digital cameras, etc., for the underfill process of bga (ball grid array package), csp…